Soldering and Surface Mount Technology

Soldering and Surface Mount Technology is an Emerald journal for research and application across every branch of soldering and surface mount assembly, and it has served the electronics manufacturing community since 1989.《焊接与表面贴装技术》是 Emerald 旗下的一份期刊，面向焊接与表面贴装各分支的研究与应用，自 1989 年起服务电子制造社群。

The 2025 journal citation report gives the title an impact factor of 2.2 and a five-year figure of 1.8, and it stands in the second quartile of metallurgy and metallurgical engineering.2025 年版期刊引证报告给出的影响因子为 2.2，五年影响因子为 1.8，该刊位于冶金与冶金工程类目的第二区。

Scope

• The journal presents itself as a multidisciplinary study of the key materials and technologies used to assemble functional electronic devices.该刊把自身呈现为对组装功能电子器件所用关键材料与技术的多学科研究。

• Its focus is on joining devices and interconnecting components by soldering, and on the joint that results.其焦点在于以焊接接合器件与互连元件，以及由此形成的焊点。

• Solder alloys are a named subject, and work on the composition and the behaviour of a solder is central to the journal.焊料合金是点名的题材，关于焊料成分与行为的工作是该刊的核心。

• Pastes and fluxes are treated in the same detail, covering the chemistry that makes a joint form and hold.焊膏与助焊剂得到同等细致的处理，涵盖使焊点得以形成并持稳的化学。

• Reliability is named among the interests, and the journal follows how a joint ages under heat, vibration and current.可靠性列于关切之中，该刊追踪焊点在热、振动与电流之下如何老化。

• Environmental effects form a subject of their own, and the journal has carried the move away from leaded solders.环境影响构成独立的题材，该刊一路见证了脱离含铅焊料的转变。

• Lead-free solders and their processes are treated at length, since the substitution raised new questions of temperature and of joint strength.无铅焊料及其工艺得到充分处理，因为这次替换带来了温度与焊点强度方面的新问题。

• Intermetallic growth between a solder and its pad is studied, a reaction that governs whether a joint survives a service life.焊料与其焊盘之间金属间化合物的生长得到研究，这一反应决定焊点能否挺过服役寿命。

• Reflow and wave soldering processes are covered, together with the thermal profile that a board must tolerate.回流焊与波峰焊工艺在覆盖之列，连同电路板必须承受的温度曲线。

• Surface mount assembly as a whole belongs to the remit, from stencil printing to the inspection that follows.表面贴装组装整体属于其范围，从模板印刷一直延伸到其后的检测。

• Inspection and reliability testing appear in the pages, covering the optical and X-ray methods used to find a hidden defect.检测与可靠性试验出现在版面中，涵盖用以发现隐蔽缺陷的光学与 X 射线方法。

• Advanced packaging, through-silicon vias and the joining of a die to a substrate fall within the journal's reach.先进封装、硅通孔以及芯片与基板的接合都在该刊触及的范围之内。

• The journal also carries work on corrosion and on the failure of an assembly in the field, reported as a case.该刊也刊载腐蚀方面以及组件在现场失效方面的工作，多以案例形式报道。

• It is described as the companion to two sister titles, Circuit World and Microelectronics International, and the three together cover electronics assembly.该刊被描述为另外两份姊妹刊《电路世界》与《国际微电子》的伴刊，三者共同覆盖电子组装。

• The readership is made up of materials scientists, process engineers and the manufacturing staff who must put a result to work on a line.读者由材料科学家、工艺工程师以及必须把结果用于产线的制造人员构成。

History

• The journal began in 1989, the year that gives the first volume of a run that reached volume 38 in 2026.该刊始于 1989 年，这一年正是其第一卷的年份，这条序列在 2026 年推进到第 38 卷。

• It has appeared throughout under the same pair of identifiers, 0954-0911 for the print issue and 1758-6836 for the electronic one.该刊自始至终沿用同一对刊号，纸本期为 0954-0911，电子期为 1758-6836。

• It is published by Emerald, a house whose roots lie in the library and management press of the British universities.该刊由 Emerald 出版，这家出版机构的根源在于英国高校的图书馆与管理类出版。

• The journal grew out of the practical needs of the electronics assembly trade, and its early issues carried as much application as theory.该刊源自电子组装行业的实际需要，其早期各期承载的应用内容与理论内容不相上下。

• The shift from leaded to lead-free soldering gave the title a long stretch of work, as the industry reworked its alloys and its thermal budgets around a new restriction.由含铅焊料向无铅焊料的转变给该刊带来一段长坡工作，行业围绕一项新限制重订其合金与热预算。

• The rise of miniature and high-density packages has kept the subject fresh, since a smaller joint carries a larger share of the load.微小型与高密度封装的出现使题材常新，因为更小的焊点承担着更大比例载荷。

• The impact factor has risen steadily in recent years, from 1.552 in 2021 and 1.494 in 2022 through 1.7 in 2023 and 1.8 in 2024 to 2.2 in 2025.影响因子近年稳步上升，由 2021 年的 1.552 与 2022 年的 1.494，经 2023 年的 1.7 与 2024 年的 1.8，升至 2025 年的 2.2。

• The journal appears quarterly through the year, and its articles are gathered into a volume that carries the calendar year.该刊全年按季出版，文章汇入与日历年对应的卷次。

• It is indexed in the science citation index expanded, and it is counted in the engineering and materials categories of the citation report.该刊被科学引文索引扩展版收录，并在引证报告的工程与材料类目中被计入。

• The journal sits in four subject categories at once, covering electrical engineering, manufacturing, materials science and metallurgy.该刊同时落在四个学科类目之中，涵盖电气工程、制造、材料科学与冶金。

• Subscription remains the usual route, and only a small share of the content, 1.14 per cent in 2025, was published gold open access.订阅仍是通常途径，内容中只有很小一部分以金色开放获取发表，2025 年为 1.14%。

• The journal keeps an eye on its own community, and each year it names the reviewers whose service held the standard of the title.该刊留心自身的共同体，每年点名致谢那些以评审维持刊物水准的人。

Editors

• The journal is run by an editor with a team of associate editors and an editorial advisory board drawn from universities and industry.该刊由一位主编连同一批副编辑以及一个取自高校与产业的编辑顾问委员会主持。

• The board brings together materials specialists and process engineers, a balance the journal needs because a solder joint is judged both chemically and mechanically.编委会把材料专家与工艺工程师汇到一处，这一平衡为该刊所需，因为一个焊点既要按化学也要按力学来评判。

• Papers are peer reviewed, and the journal states that a submission is assessed for its novelty and for its relevance to the assembly of real devices.稿件经同行评议，该刊声明来稿会就其新意以及与真实器件组装的相关性接受评估。

• Manuscripts are submitted through the publisher's online system, and the guidance sets a limit of six thousand words on a research paper.稿件经出版方的在线系统提交，指南对研究论文设定六千词的上限。

• Besides research papers, the journal takes review papers, shorter technical notes, book reviews and news items.研究论文之外，该刊还收综述、较短的技术札记、书评与消息。

• A technical note is asked to describe a method or a material in a form that an engineer on a line can act on.技术札记被要求以产线工程师能据以行动的形式描述一种方法或一种材料。

• Authors are expected to give the process parameters with a result, since a joint property means little without the profile that produced it.该刊期望作者在给出结果时一并给出工艺参数，因为缺少产生它的温度曲线，焊点性能便意义不大。

• An accepted paper may be made open access by payment, the journal otherwise distributing its content through subscription.被录用的论文可以缴费转为开放获取，该刊其余内容则通过订阅分发。

• The editors ask reviewers to weigh whether a reported result would transfer to manufacturing, a test the journal applies to its own content.编辑请审稿人衡量所报结果能否迁移到制造，这也是该刊对自身内容所持的尺度。

• The journal carries work on thermal management, since the heat a device makes must leave it through the same joints that carry the current.该刊刊载热管理方面的工作，因为器件产生的热必须经由承载电流的同一批焊点排出。

• Electromigration within a joint is studied, a slow failure that becomes pressing as a joint grows smaller and carries more current.焊点内的电迁移得到研究，这是一种缓慢的失效，随着焊点变小而承载电流增大而变得紧迫。

• Work on stencil printing and on the deposit it leaves belongs to the scope, since the paste that is printed sets the joint that follows.模板印刷及其所留沉积层方面的工作属于其范围，因为所印制焊膏决定了其后的焊点。

• The journal also carries work on conductive adhesives and on other joining methods that stand beside soldering for a heat-sensitive assembly.该刊也刊载导电胶以及焊接之外其他接合方法的工作，用于对热敏感的组件。

• The journal carries work on the inspection of a joint, covering the X-ray and the acoustic methods used to see inside one.该刊刊载焊点检测方面的工作，涵盖用以看清焊点内部的 X 射线与超声方法。

• Work on the cleanliness of a board belongs to the scope, since a residue can undermine a joint that otherwise looks sound.电路板清洁度方面的工作属于其范围，因为残留物会使原本看似完好的焊点失效。