Materials Science in Semiconductor Processing

Materials Science in Semiconductor Processing is an Elsevier journal founded in 1998 that provides a forum for novel processing, applications and theoretical studies of functional materials and devices for optoelectronics, sensors, detectors, biotechnology and green energy, with a 2025 Journal Impact Factor of 5.2《半导体加工中的材料科学》（Materials Science in Semiconductor Processing）是（Elsevier）1998 年创办的期刊，为（光）电子、传感器、探测器、生物技术与绿色能源领域功能材料及器件的新型加工、应用与理论研究提供交流平台，2025 年影响因子为 5.2。

Scope

• Advanced lithography, etching, doping, annealing and thin film processing for submicron and nanoscale devices define the first block of coverage面向亚微米与纳米器件的先进光刻、刻蚀、掺杂、退火与薄膜工艺构成其首要收稿方向。
• Ion implantation, damage evolution, plasma and thermal chemical vapour deposition, and rapid thermal processing are treated as core process technologies离子注入、损伤演化、等离子体与热化学气相沉积以及快速热处理被视为核心工艺技术。
• Metallization and interconnect schemes, thin dielectric layers and oxidation, sol-gel processing, and chemical bath or electrochemical deposition are all within remit金属化与互连方案、薄介质层与氧化、溶胶凝胶处理以及化学浴与电化学沉积均在收稿范围内。
• Compound semiconductor processing, new non-oxide materials, and macromolecular, hybrid and composite materials are covered alongside conventional silicon work化合物半导体加工、新型非氧化物材料以及大分子、杂化与复合材料，与传统硅基研究并列覆盖。
• Modelling contributions built on molecular dynamics, ab initio methods and Monte Carlo simulation, together with crystal growth mechanisms, are explicitly welcomed基于分子动力学、从头算方法与蒙特卡洛模拟的建模研究，以及晶体生长机制，明确受到欢迎。
• Magnetic materials and spintronics, heterostructures and quantum devices, engineering of electrical and optical properties, and reliability, defect density and impurity issues complete the device side磁性材料与自旋电子学、异质结构与量子器件、电学与光学性质调控，以及可靠性、缺陷密度与杂质问题，构成器件一侧的覆盖。
• Application areas include microelectronics, energy conversion and storage, communications, biotechnology, photocatalysis, nano and thin film technology, and device fabrication应用领域包括微电子、能量转换与存储、通信、生物技术、光催化、纳米与薄膜技术以及器件制造。

History

• The journal was established by Elsevier in 1998, and its first volume carried papers on low-energy ion damage and selective tungsten chemical vapour deposition该刊由（Elsevier）于 1998 年创办，第 1 卷即刊载低能离子损伤与选择性钨化学气相沉积等论文。
• It is edited and produced from Elsevier's Oxford office at Kidlington, with manuscripts handled through the Editorial Manager system该刊由（Elsevier）设于牛津基德灵顿的办公室编辑出版，稿件经（Editorial Manager）系统处理。
• Output has grown to more than a dozen volumes a year and roughly a thousand articles annually, with volume 216 reached in 2026发文规模已增至每年十余卷、约一千篇，2026 年出版至第 216 卷。
• Its impact factor rose from 3.927 in 2021 and 4.644 in 2022 to 4.6 in 2024 and 5.2 in 2025其影响因子由 2021 年的 3.927、2022 年的 4.644 上升至 2024 年的 4.6 与 2025 年的 5.2。
• In the 2025 Journal Citation Reports it is first quartile in engineering, electrical and electronic at 85th of 369 and in applied physics at 46th of 191, and second quartile in materials science multidisciplinary and condensed matter physics在 2025 年期刊引证报告中，其电子电气工程类列 369 种期刊第 85 位、应用物理类列 191 种期刊第 46 位，均属第一四分位，材料科学综合与凝聚态物理类属第二四分位。
• It is indexed in Science Citation Index Expanded and Scopus and follows a hybrid model, with most papers behind subscription and a small share published gold open access该刊被（Science Citation Index Expanded）与（Scopus）收录，采用混合出版模式，多数论文以订阅方式发布，少量以金色开放获取发表。

Editors

• The editorial office sits with Elsevier in Oxford, and all submissions enter through Editorial Manager, where handling editors assign referees by subject area编辑部设于（Elsevier）牛津办公室，全部稿件经（Editorial Manager）提交，由责任编辑按学科方向指派审稿人。
• Aloysius F. Hepp, a former technologist at the NASA Glenn Research Center, is editor-in-chief emeritus and chairs the journal's international advisory board（Aloysius F. Hepp）为美国航天局格伦研究中心退休技术专家，现任该刊荣誉主编并主持国际顾问委员会。
• The board draws members from universities and institutes in the United States, Japan, China, Finland, Estonia, Moldova and Korea, spanning thin film deposition, atomic layer deposition, compound semiconductors and device processing编委来自美国、日本、中国、芬兰、爱沙尼亚、摩尔多瓦与韩国的高校及研究所，覆盖薄膜沉积、原子层沉积、化合物半导体与器件工艺。
• Special issues are organised around conference series in the field, among them the gettering and defect engineering meetings known as GADEST, with guest editors appointed for each collection期刊围绕本领域的系列会议组织专刊，其中包括以硅中吸杂与缺陷工程为主题的（GADEST）会议，每辑专刊均聘请客座编辑。
• Every manuscript is assessed by the handling editor and then sent to independent referees, and the journal publishes both original research papers and review articles每篇稿件先由责任编辑评估，再送独立审稿人评审，期刊同时刊发原创研究论文与综述文章。