IEEE Transactions on Components, Packaging and Manufacturing Technology

IEEE Transactions on Components, Packaging and Manufacturing Technology is a journal of the IEEE Components, Packaging and Manufacturing Technology Society, covering the science behind electronic packaging, founded in 2011.《IEEE 元件、封装与制造技术汇刊》是 IEEE 元件、封装与制造技术学会的期刊，覆盖电子封装背后的科学，创办于 2011 年。

The title carries research and application articles on modelling, design, building blocks, technical infrastructure and the analysis that underpins a package.该刊刊载建模、设计、构建单元、技术基础设施以及支撑封装的各类分析方面的研究与应用文章。

In the 2025 edition of the journal citation report it holds an impact factor of 3.3 and stands in the second quartile of electrical and electronic engineering.在 2025 年版期刊引证报告中，该刊的影响因子为 3.3，在电气与电子工程类目中列第二区。

Scope

• Modelling is named first, and the journal carries work that predicts the behaviour of a package before it is built.建模被列在首位，该刊刊载在封装制成之前预测其行为的工作。

• Design belongs to the scope, and studies of how a component or a package is laid out are admitted.设计属于收稿范围，关于元件或封装如何布局的研究受到收载。

• Building blocks are treated as a subject, and the journal follows the parts from which a larger assembly is made.构建单元自成一个选题，该刊追踪构成更大组件的那些零件。

• Technical infrastructure appears in the statement, and work on the processes and the plant behind production is taken.技术基础设施见于宗旨说明，关于生产背后的工艺与装置的工作受到收载。

• Analysis underpins the field, and the journal carries the measurement and the interpretation that tell whether a package will hold.分析支撑着这一领域，该刊刊载判断封装能否维持的测量与解读。

• Electronic packaging is central, and the journal carries work on the housings and substrates that turn a chip into usable hardware.电子封装居于中心，该刊刊载把芯片变成可用硬件的壳体与基板方面的研究。

• Photonic packaging is admitted, and studies of the assembly of optical devices and of their coupling are taken.光子封装也在接纳之列，关于光器件组装及其耦合的研究受到收载。

• Packaging for microelectromechanical systems is covered, and the journal follows the difficulties that arise when a moving part must be sealed.微机电系统的封装得到覆盖，该刊追踪可动部件必须被封住时出现的种种难题。

• Sensor packaging belongs to the scope, and work on the enclosure that lets a sensor meet the world is admitted.传感器封装属于收稿范围，关于让传感器得以接触外部世界的封装的工作也在接纳之列。

• New developments in passive and integrated components are named, and the journal carries work on both.无源与集成元件的新进展被点名，该刊对两者都予收载。

• Electrical contacts and connectors form a strand, and studies of the interface where two conductors meet are taken.电接触与连接器构成一支，关于两导体相接界面的研究受到收载。

• Bonding and interconnection are treated, and the journal carries work on the joints that carry both current and mechanical load.键合与互连得到处理，该刊刊载既传导电流又承受机械载荷的接头方面的研究。

• Reliability and failure modes are covered, and the journal follows the ways in which a package eventually gives way.可靠性与失效模式得到覆盖，该刊追踪封装最终失效的种种方式。

• Materials for electronics appear among the subjects, and work on the metals, ceramics and polymers used in a package is admitted.电子材料见于选题之中，关于封装所用金属、陶瓷与高分子材料的工作受到收载。

• Thermal management is treated at length, taking in thermomechanics, thermal measurement, cooling technology and thermal phenomena in electronics.热管理得到细致处理，涵盖热力学、热测量、冷却技术以及电子器件中的热现象。

• The readership is drawn from industry and from universities, and the journal is written for engineers who build as well as for those who study.读者来自产业界与高校，该刊既为动手制造的工程师写作，也为从事研究的人写作。

• Heterogeneous integration is treated, and the journal carries work on joining devices made by different processes into one package.异质集成得到处理，该刊刊载把由不同工艺制成的器件并入同一封装的工作。

• Three dimensional stacking is covered, and studies of vertical interconnection and of heat removal through a stack are taken.三维堆叠得到覆盖，关于垂直互连与穿过堆叠排热的研究受到收载。

• Ceramic and organic substrates are treated together, and the journal carries work on the materials and the processes behind each.陶瓷基板与有机基板被一并处理，该刊刊载二者背后的材料与工艺方面的工作。

• Testing and characterisation form a strand, and the journal carries work on how a package is inspected once it is made.测试与表征构成一支，该刊刊载封装制成之后如何检验的工作。

• Authors are asked to give the dimensions and the conditions of a test, so that a reported result can be reproduced.作者须给出试验的尺寸与条件，使所报结果可以重现。

• The journal carries a small number of open access papers beside the rest, and the share is published with its metrics.该刊在其余论文之外刊载少量开放获取论文，其占比随指标一并公布。

History

• The present title began in 2011, and the volume numbering was restarted at one with the change of name.现行刊名始于 2011 年，卷号随更名自第 1 卷重新起算。

• It took the place of an earlier journal on components and packaging technologies, which ceased publication in 2010.它取代了一份更早的元件与封装技术期刊，后者于 2010 年停刊。

• That journal had itself been formed from a three part series that ran from 1994 to 1998, covering component packaging, advanced substrates and manufacturing.那份期刊本身则由 1994 至 1998 年间运行的三分系列并成，分别覆盖元件封装、先进基板与制造。

• The journal is owned by its society, whose field of interest spans materials science, chemical processes, reliability engineering and mathematical modelling.该刊归其学会所有，该学会的关切范围横跨材料科学、化学工艺、可靠性工程与数学建模。

• The society's scope reaches from raw materials to finished electronic assemblies, and the journal reflects that breadth.该学会的范围自原材料一直到成品电子组件，该刊反映了这一宽度。

• The title is published by the institute from Piscataway in New Jersey, and it appears on the institute's own digital library.该刊由该学会在新泽西州皮斯卡塔韦出版，刊登在学会自有的数字图书馆上。

• The print number is 2156-3950 and the electronic number is 2156-3985, though the journal is read almost entirely online.印刷版编号为 2156-3950，电子版编号为 2156-3985，尽管该刊几乎完全在线上被阅读。

• Twelve issues are gathered into a year, and the journal has moved to a monthly rhythm in its recent volumes.该刊每年汇集十二期，近年各卷已转为月刊的节奏。

• Selected citations only are carried in PubMed, while the journal is fully covered by the engineering citation services.PubMed 只收录该刊的部分引文，而工程类引文服务对它的覆盖是完整的。

• The impact indicator has moved from 1.738 and 1.922 to 2.3 and 3, and it stood at 3.3 in the 2025 edition.影响因子从 1.738 与 1.922 变为 2.3 与 3，在 2025 年版为 3.3。

• A small share of the papers is free to read on publication, and the journal follows the open access arrangements of its publisher.该刊只有很小一部分论文在出版时即可免费阅读，刊物遵循其出版方的开放获取安排。

• The journal carries an editorial note from time to time, and the editor may be reached through the address published with the journal.该刊不时刊出编辑说明，读者可经刊物上公布的地址与编辑取得联系。

Editors

• The journal is edited under the authority of its society, and the editor is assisted by a body of associate editors.该刊在其学会的授权下编辑，主编由一批副编辑协助。

• Associate editors are drawn from industry and from universities, which suits a field where a part is designed and then made.副编辑来自产业界与高校，这适合一个先设计、后制造的领域。

• Manuscripts are submitted through the institute's online system and are sent to independent referees for peer review.稿件通过该学会的在线系统投递，并送交独立审稿人进行同行评审。

• The journal takes regular papers, and it sets out its expectations for length, for figures and for the form of a reference list.该刊收载常规论文，并对篇幅、图表与参考文献格式提出要求。

• Authors are expected to report their methods fully, so that another laboratory can repeat a measurement.作者须完整报告方法，使另一间实验室能够重现某项测量。

• Ethical conduct is required of authors and referees alike, and the journal states its expectations in a published policy.作者与审稿人都须遵守伦理规范，该刊在公开的政策中写明其要求。

• A manuscript must be unpublished and must not be under consideration elsewhere, and all co-authors must consent before submission.来稿须未曾发表且未在他处审议，投稿之前所有共同作者都须知情同意。

• Open access publication carries a charge, and the journal and its publisher set out the options available to an author.开放获取出版收取费用，该刊及其出版方说明作者可选的各项方案。

• The editorial office answers queries by email and guides a manuscript from submission through to a decision.编辑部以电子邮件答复查询，并引导稿件自投稿走到决定。

• The board is meant to cover the breadth of the field, so that a paper is judged by a reader who knows the process it describes.编委会力求覆盖领域的宽度，使论文由通晓其所描述工艺的读者来评判。