IEEE Sensors Letters

IEEE Sensors Letters is an electronic letters journal published by the Institute of Electrical and Electronics Engineers and sponsored by the IEEE Sensors Council, launched in 2017 for short papers on sensors and sensing technology, with a 2025 Journal Impact Factor of 2.4.《IEEE 传感器快报》由美国电气电子工程师学会（Institute of Electrical and Electronics Engineers）出版，IEEE Sensors Council 主办，2017 年创刊，专门刊载传感器与传感技术方面的短篇论文，2025 年期刊影响因子为 2.4。

Scope

• The stated scope runs across all aspects of sensors and sensing technology, from theory, design and fabrication to manufacturing, signal processing, interface circuits and the applications of devices that sense and transduce physical, chemical and biological phenomena.刊物声明的范围覆盖传感器与传感技术的各个方面，从理论与设计，经制造与生产工艺，到信号处理与接口电路，再到把物理现象、化学现象与生物现象转换为电信号的器件应用。
• The journal says its scope is the same as that of IEEE Sensors Journal, with the emphasis falling on the electronics and physics of sensors and of integrated sensor-actuators.刊方说明其范围与 IEEE Sensors Journal 相同，重心放在传感器以及集成传感-执行器的电子学与物理学层面。
• Sensing phenomena and their characterization open the EDICS classification, where entries run from sensitivity and selectivity through noise, ageing and hysteresis to dynamic range and immunity to interference.传感现象及其表征是 EDICS 分类的开端，条目涵盖灵敏度与选择性，也涵盖噪声、老化与迟滞，再往下是动态范围与抗干扰能力。
• System-level work follows, covering sensor system integration, intelligent sensing and the electronic nose, in which an array of partly selective devices is read as a whole rather than one device at a time.系统层面的工作紧随其后，覆盖传感器系统集成、智能传感与电子鼻，其中部分选择性的器件阵列被整体读取，并不逐个读取。
• Mechanical sensors take in strain gauges and pressure sensors, along with accelerometers, angular rate sensors and flow meters, a family that still supplies much of the measurement content in each volume.力学量传感器包含应变计与压力传感器，也包含加速度计、角速率传感器与流量计，这一族至今仍是每卷测量类内容的主要来源。
• Thermal sensing covers thermistors and thermocouples, and also platinum resistance thermometers and bolometers, with the physics of heat transfer never far from the design argument in that literature.热学传感涵盖热敏电阻与热电偶，也涵盖铂电阻温度计与辐射热计，传热物理在这类文献里始终紧贴器件的设计论证。
• Optoelectronic and photonic devices enter through photodiodes and charge-coupled devices, and the image and vision sensors built on them are equally at home here.光电与光子器件经由光电二极管与电荷耦合器件进入范围，建立在两者之上的图像与视觉传感器同样在列。
• Integrated optics and fibre-optic devices hold a heading of their own, spanning surface plasmon resonance and interferometry, with fibre Bragg gratings named alongside them.集成光学与光纤器件自成一个条目，覆盖表面等离子体共振与干涉测量，光纤布拉格光栅也在其列。
• Microwave and millimetre-wave sensing sits beside magnetic sensing, where Hall devices, magnetoresistive elements and magnetometers turn field strength into an electrical signal.微波与毫米波传感同磁传感并列，霍尔器件、磁阻元件与磁强计把磁场强度转成电信号。
• Chemical and biological sensors form a large block, and microfluidics and lab-on-chip platforms are treated as part of the sensor rather than as a separate discipline.化学与生物传感器构成一大板块，微流控与芯片实验室平台被当作传感器本身的一部分，不另立学科。
• Mass-sensitive devices such as quartz crystal microbalances and surface acoustic wave resonators are listed separately, as are combined sensors and integrated sensor-actuators.石英晶体微天平与声表面波谐振器等质量敏感器件单独列出，复合传感器与集成传感-执行器也各有位置。
• Application systems are named one at a time, taking in automotive and medical sensing, environmental and consumer devices, security, military, aeronautical and space systems, and robotics.应用系统逐一列出，汽车与医疗各有对应条目，环境监测与消费电子另立一组，安防、军事与航空航天传感以及机器人系统也各占位置。
• Packaging and interconnection, sensor materials and solid-state sensors are three further headings, a reminder that a device is often limited by its package and its material.封装与互连、传感材料与固态传感器是另外三个条目，提醒人们器件的性能常受封装与材料限制。
• Signal processing, array sensor fusion and sensor data processing sit at the output end, the last of them naming pattern recognition, machine learning and evolutionary computation.信号处理、阵列融合与传感数据处理位于输出端，最后一项点明模式识别、机器学习与进化计算。
• Sensor networks and wireless sensors cover distributed deployment, while CAD modelling and testing address the stage before a device is built.传感网络与无线传感器涉及分布式部署，建模与计算机辅助测试则处理器件造出之前的那一段。
• A statement issued on 31 July 2025 restates the boundary, since work that is purely algorithmic, with no demonstrated and measurable impact on a sensor device or system, is declined without review.2025 年 7 月 31 日发布的说明重申了这条边界，纯算法性质且对传感器件或系统没有可测影响的工作，不送外审即退。
• Applications that merely use a sensor, with no innovation in the component or the system, fall outside as well, and so do results presented without experimental validation.仅仅使用了传感器而在器件或系统层面没有创新的应用同样出界，缺少实验验证的结果也不在范围之内。

History

• Publication began in February 2017, and volume 1 carries that year, so the eleventh issue of volume 10 in November 2026 closes a tenth annual cycle.刊物于 2017 年 2 月开始出版，第 1 卷记在那一年，2026 年 11 月的第 10 卷第 11 期正好走完第十个年度周期。
• Speed is the founding argument. The point is to publish short manuscripts quickly, on the latest and most significant developments in sensors, because some results cannot wait for a full-length venue.速度是创刊的核心理由，目的就是快速发表传感器领域最新且最重要的短稿，因为有些结果等不起长篇期刊的周期。
• The median time from submission to electronic publication is given as 4.8 weeks, a figure printed in the banner that runs across the journal home page.从投稿到电子出版的中位时间为 4.8 周，这个数字印在刊页顶端的常驻横幅上。
• A single number, 2475-1472, fills both the print and the electronic columns, a sign that the journal was designed for electronic delivery from the outset.2475-1472 这一个编号同时填在纸本与电子两栏，说明刊物从设计之初就以电子投递为主。
• Issues now appear monthly, twelve a year, and the recent-issues list runs from volume 10 issue 9 in September 2026 to issue 11 in November 2026 without a break, while some bibliographic records still carry an older six-issue figure.刊物现为月刊，每年 12 期，近期目次从 2026 年 9 月的第 10 卷第 9 期排到 11 月的第 11 期，中间没有空档，部分书目记录则仍写着每年 6 期的旧数字。
• A four-page ceiling was part of the design from the start, with at least one column reserved for references, and authors whose papers run longer are directed to IEEE Sensors Journal.4 页上限从创刊起就是设计的一部分，其中至少一栏专门留给参考文献，篇幅超出的作者会被引向 IEEE Sensors Journal。
• Conference papers are not republished here, which keeps the letters stream distinct from proceedings, and every manuscript has to use the journal's own double-column template.会议论文不在本刊重发，快报因而与会议录区分开来，每篇稿件还须套用本刊的双栏模板。
• IEEE owns the copyright of what it publishes, and the journal is hybrid open access, so the subscription route carries no page charges, colour figures are free online and an open licence is an option for a fee.IEEE 拥有所发表内容的版权，刊物走混合开放获取，订阅路线不收版面费，彩色图在线上免费，开放许可则是付费可选项。
• The 2025 Journal Impact Factor is 2.4 and the five-year figure is 2.5, while the growth panel on the about page still prints 2.2 from an earlier release.2025 年期刊影响因子为 2.4，五年影响因子为 2.5，而刊内介绍页的增长栏仍印着上一版次的 2.2。
• Three recent years read 2.2 for 2023, 2.2 for 2024 and 2.4 for 2025, a flat profile that moved only at the last measurement.近三年分别为 2023 年 2.2、2024 年 2.2 与 2025 年 2.4，曲线大体平缓，只在最后一次测量时抬升。
• The article influence score is 0.426 and the Eigenfactor 0.00441, both printed beside the impact factor on the home page.文章影响力分值为 0.426，特征因子为 0.00441，两项都印在刊页影响因子旁边。
• Journal Citation Reports places the title in three ESCI categories, a Q2 position at 40 of 81 in instruments and instrumentation, and Q3 positions in electrical and electronic engineering and in applied physics.期刊引证报告把它列入三个 ESCI 类目，仪器与仪表类目 81 种中排第 40 位属 Q2，电气电子工程与应用物理两个类目则落在 Q3。
• Output runs at about 459 articles a year, total citations reach 4234, and a cited half-life of 2.8 years suggests a literature that is still being replaced quickly.年发文约 459 篇，总被引 4234 次，2.8 年的被引半衰期说明相关文献的更替仍然很快。
• Indexing is limited to the Emerging Sources Citation Index, and PubMed records selected citations only rather than the whole output.收录范围限于 Emerging Sources Citation Index，PubMed 只登记部分引用，并未覆盖全部产出。

Editors

• Andrei Shkel of the University of California Irvine is editor-in-chief, and his name heads both the board page and the banner of the journal home page.主编为（Andrei Shkel），任职于 University of California Irvine，编委页与刊页横幅都以他的名字领衔。
• Three associate editors-in-chief share the load, Francisco Falcone of the Universidad Publica de Navarra in Spain, Thilo Sauter of TU Wien and Danube University Krems in Austria, and Giacomo Langfelder of the Politecnico di Milano in Italy.三位副主编分担日常工作，分别是西班牙 Universidad Publica de Navarra 的（Francisco Falcone），奥地利 TU Wien 与 Danube University Krems 的（Thilo Sauter），以及意大利 Politecnico di Milano 的（Giacomo Langfelder）。
• Topical editors cover three standing areas, with Troy Olsson of the University of Pennsylvania on wireless sensors, Huikai Xie of the Beijing Institute of Technology on optical sensors and Christian Zorman of Case Western Reserve University on chemical and biological sensors.栏目编辑对应三个常设方向，无线传感由 University of Pennsylvania 的（Troy Olsson）负责，光学传感由 Beijing Institute of Technology 的（Huikai Xie）负责，化学与生物传感由 Case Western Reserve University 的（Christian Zorman）负责。
• The associate editor roster runs to several pages and draws on the United States, China, India, Italy, Spain, the United Kingdom, Canada, Taiwan, Hungary, Sweden, Australia, Austria and South Korea.副编辑名单长达数页，成员来自美国与中国，也来自印度与意大利，西班牙、英国与加拿大在列，台湾、匈牙利与瑞典各有代表，澳大利亚、奥地利与韩国同样有人。
• Industry is represented as well, by Cristiano Marra of TDK InvenSense in Milan and Jeronimo Segovia of Texas Instruments Kilby Labs in Santa Clara, with Chi Wah Kok of Canaan Semiconductor in Australia and Matthew Stewart of Pelago Health in New York also on the list.产业界同样有代表，成员包括米兰 TDK InvenSense 的（Cristiano Marra）与圣克拉拉 Texas Instruments Kilby Labs 的（Jeronimo Segovia），澳大利亚 Canaan Semiconductor 的（Chi Wah Kok）和纽约 Pelago Health 的（Matthew Stewart）也在名单内。
• Srinivas Tadigadapa of Northeastern University was the founding editor-in-chief and held the post from 2017 to 2022, a span that covers the first six volumes.创刊主编为（Srinivas Tadigadapa），任职于 Northeastern University，任期从 2017 年到 2022 年，覆盖最初的六个卷。
• Review is blind, and the guide for reviewers states that the identity of every reviewer is carefully protected.评审采用盲审，审稿人指南写明每位审稿人的身份都受到严格保护。
• Reviewers choose among four recommendations, publish unaltered, publish with minor required changes, reject and resubmit, or reject on the ground that the paper is seriously flawed.审稿人从四档结论中选择，可以原样发表，可以小修后发表，可以退稿并允许重投，也可以因论文存在严重缺陷而直接拒稿。
• A minor revision is checked by the handling associate editor without a second round of external review, while a resubmission is treated as a new paper and its clock starts again.小修由负责的副编辑裁定，不再走第二轮外审，重投稿则按新稿处理，审稿时钟重新起算。
• Manuscripts go through ScholarOne at mc.manuscriptcentral.com/sensors-letters, and the instructions ask authors not to send submissions or revisions to the editor-in-chief or to an associate editor directly.稿件经 mc.manuscriptcentral.com/sensors-letters 的 ScholarOne 系统提交，投稿指南要求作者不要把原稿或修改稿直接寄给主编或副编辑。
• Each submission needs the double-column template, an ORCID identifier, a single EDICS category and the names of at least two potential reviewers from other institutions with no tie to the authors.每篇投稿都须套用双栏模板，提供 ORCID 标识，选定一个 EDICS 类目，并推荐至少 2 位来自其他机构且与作者没有合作或亲属关系的审稿人。
• Multiple submission brings immediate rejection, the return of the same authors' other manuscripts still under review, and a ban on new submissions for at least one calendar year.一稿多投会立即拒稿，同一位作者在审的其他稿件一并退回，并在至少一个日历年之内禁止再投。
• The editorial office asks reviewers to finish one report before taking on more, so that no manuscript is left waiting on a referee whose desk is already full.编辑部希望审稿人先完成一轮意见，再决定是否接受追加邀请，免得稿件卡在任务过重的审稿人手里。