IEEE Internet of Things Magazine

IEEE Internet of Things Magazine is a quarterly magazine launched by IEEE in 2018 that publishes peer-reviewed papers on end-to-end Internet of Things deployments for engineers and researchers in industry, and it holds a 2025 Journal Impact Factor of 5.8.《IEEE 物联网杂志》（IEEE Internet of Things Magazine）由（IEEE）于 2018 年创办，为季刊，刊载面向产业工程师与研究者的端到端物联网部署同行评审论文，2025 年期刊影响因子为 5.8。

Scope

• The magazine is built around end-to-end IoT solutions rather than isolated component research, and its papers are written by and for practitioners as well as academics.本刊以端到端物联网解决方案而非孤立部件研究为核心，论文作者与读者既包括学者也包括实践者。
• Its technical focus is the multidisciplinary, systems nature of IoT deployments, where sensing, connectivity, computing and application design have to be solved together.技术重点在于物联网部署的多学科系统性，即感知、连接、计算与应用设计必须协同解决。
• Vertical coverage is organised editorially into connected IoT services, connected vehicles, industrial IoT and smart cities.行业应用按编辑分工划分为互联物联网服务、车联网、工业物联网与智慧城市。
• Artificial intelligence for IoT is treated as a standing miniseries, alongside a second miniseries on signal processing for IoT.面向物联网的人工智能为常设专题系列，另有物联网信号处理专题系列。
• A standards column examines how specific verticals are affected by standards and by the technologies shaping the IoT market.标准专栏考察特定行业如何受到标准以及塑造物联网市场的各类技术影响。
• An Around the World of IoT column tours regions to show how local conditions shape applications and business sustainability.“环游物联网世界”专栏巡览各地区，展示本地条件如何塑造应用与商业可持续性。
• Submissions are expected to run to about 4,500 words with up to six figures or tables and no more than fifteen selected references.投稿篇幅约 4500 词，图表不超过 6 个，参考文献精选不超过 15 条。

History

• The first issue appeared in September 2018 as volume 1, number 1, with Keith Gremban as founding editor-in-chief and IEEE as publisher.首期于 2018 年 9 月以第 1 卷第 1 期面世，创始主编为 Keith Gremban，出版方为（IEEE）。
• It was issued quarterly in print and electronic form, with a print subscription price and an electronic subscription price set separately.创刊时为季刊，纸本与电子版并行，纸本与电子订阅分别定价。
• Editorial direction sits with the IEEE Communications Society, which lists the title in its magazine portfolio under a director of magazines.编辑方向由（IEEE Communications Society）负责，该会在其期刊群中设有杂志总监一职管理本刊。
• A management committee with delegates from IEEE societies, among them circuits and systems, control systems, electron devices, industrial electronics, power and energy, and signal processing, oversees the title.由（IEEE）各分会代表组成的管理委员会监督本刊，成员包括电路与系统、控制系统、电子器件、工业电子、电力与能源、信号处理等分会。
• The magazine carries both a print ISSN, 2576-3180, and an electronic ISSN, 2576-3199, and is indexed in the Web of Science ESCI collection.本刊同时拥有印刷 ISSN 2576-3180 与电子 ISSN 2576-3199，并被（Web of Science）的（ESCI）收录。
• The 2025 Journal Impact Factor is 5.8, with first quartile placings in computer science information systems at 52 of 266, electrical and electronic engineering at 67 of 369, and telecommunications at 29 of 127.2025 年期刊影响因子为 5.8，在计算机信息系统类 266 种期刊中列第 52 位、电气与电子工程类 369 种中列第 67 位、电信类 127 种中列第 29 位，均为 Q1。

Editors

• Rath Vannithamby of Intel Labs is editor-in-chief, and Maurice Khabbaz of the American University of Beirut serves as associate editor-in-chief.主编为（Intel Labs）的 Rath Vannithamby，副主编为贝鲁特美国大学的 Maurice Khabbaz。
• Yi Qian of the University of Nebraska-Lincoln acts as director of magazines, the post that connects the title to the Communications Society's publications board.内布拉斯加大学林肯分校的 Yi Qian 担任杂志总监，该职位把本刊与通信学会出版委员会连接起来。
• A steering committee of senior editors comprises Marco Di Renzo of CentraleSupelec, Arumugam Nallanathan of Queen Mary University of London and Zhisheng Niu of Tsinghua University.资深编辑指导委员会由巴黎中央理工的 Marco Di Renzo、伦敦玛丽女王大学的 Arumugam Nallanathan 与清华大学的 Zhisheng Niu 组成。
• Vertical area editors cover connected services, connected vehicles, industrial IoT and smart cities, while miniseries leads handle AI for IoT and signal processing for IoT.行业领域编辑分别负责互联服务、车联网、工业物联网与智慧城市，专题系列则由“物联网人工智能”与“物联网信号处理”负责人牵头。
• The associate editor roster of roughly two dozen researchers is weighted towards industrial laboratories such as Intel, Ericsson, Qualcomm, Nokia, Samsung and InterDigital, alongside university groups.约二十余位副编辑以产业实验室为主，来自（Intel）、（Ericsson）、（Qualcomm）、（Nokia）、（Samsung）与（InterDigital）等企业，同时也有高校团队。
• Standing columns have their own editors, including N. Kishor Narang of Narnix Technolabs for the standards column, and guest editors assemble themed issues around verticals.常设专栏有专属编辑，标准专栏由（Narnix Technolabs）的 N. Kishor Narang 主持，专题刊则由客座编辑围绕行业主题组稿。